SCHOTT HermeS® represents a significant advancement in the field of hermetic sealing for semiconductor applications. This innovative technology, based on specialized glass wafers, offers unparalleled performance and reliability, addressing critical challenges in the creation of high-performance, long-lasting electronic devices. The core of the SCHOTT HermeS® system lies in its unique hermetic through-glass vias (TGVs), enabling the creation of robust, leak-tight connections within integrated circuits and other microelectronic components. This article will delve into the intricacies of SCHOTT HermeS® technology, exploring its applications, advantages, manufacturing processes, and the future of this groundbreaking innovation.
HermeS® Hermetic Through Glass Vias Wafers: The Foundation of Reliability
The heart of SCHOTT HermeS® technology resides in its highly specialized glass wafers. These are not ordinary glass substrates; they are meticulously engineered to possess exceptional properties crucial for hermetic sealing. The wafers are manufactured using advanced glass-forming techniques, ensuring high purity, homogeneity, and precise dimensional control. This precision is paramount, as even minute variations can compromise the integrity of the hermetic seal. The key to the HermeS® system is the integration of hermetic through-glass vias (TGVs). These vias are essentially microscopic channels drilled through the glass wafer, providing pathways for electrical connections while maintaining a hermetic barrier.
The creation of these TGVs is a highly sophisticated process. It involves precise laser ablation or other advanced micromachining techniques to create the vias with exceptional accuracy and control over their dimensions and surface roughness. The process must ensure that the vias are perfectly cylindrical and free from any imperfections that could lead to leaks or compromise the hermetic seal. The precise control over the via dimensions is critical for ensuring consistent electrical performance and minimizing parasitic capacitance. After the via creation, the process often involves a surface treatment to optimize adhesion and compatibility with subsequent processing steps. This might involve plasma etching, chemical mechanical polishing (CMP), or other surface modification techniques.
The hermeticity of the TGVs is ensured through a combination of factors. The inherent properties of the glass itself provide a significant barrier to gas and moisture permeation. Furthermore, the precise manufacturing process minimizes surface defects and ensures a smooth, continuous glass surface around the vias. In many cases, a post-processing sealing step further enhances the hermeticity, potentially involving the deposition of a thin film or the application of a specialized sealant. This ensures that the vias remain completely sealed, preventing the ingress of moisture, oxygen, or other contaminants that could degrade the performance or reliability of the electronic components.
SCHOTT HermeS® Glass Wafers with Hermetic Through-Glass Vias: Applications and Advantages
The superior hermeticity offered by SCHOTT HermeS® glass wafers with TGVs opens up a wide range of applications in various high-reliability electronic systems. These applications often demand exceptional performance under harsh conditions, where traditional packaging methods might fail. Some key applications include:
* Automotive Electronics: The harsh environmental conditions experienced by automotive electronics, including extreme temperatures, vibrations, and moisture, necessitate robust packaging solutions. SCHOTT HermeS® technology provides the necessary hermetic seal to protect sensitive components and ensure long-term reliability, crucial for applications such as advanced driver-assistance systems (ADAS) and electric vehicle (EV) powertrains.
current url：https://ydunpu.e313c.com/all/schott-hermes-50924